OLED Technologies B.V.
PCAP20
The Company is currently creating its next generation of single line production equipment. This equipment includes new proprietary processes for printing various types of materials onto customized substrates, and new approaches to encapsulating displays. The Company concentrates heavily on research and development, and is developing new processes, printing capability and contained manufacturing environments, to make display products using polymer light emitting diode, soluable smoled and phosphorescent, or doped dry smoled material.
The PCAP20 is the first single line process to make OLED Displays. It uses ink jet printers to deposit polymer light emitting diodes on substrates, and has an advanced process for sealing these depositions with thin film encapsulation. It is scheduled for release in Q4 2009.
The PCAP-20 is a fully integrated modular production system for OLED displays, based on OTB’s unique Thin Film Encapsulation process. It produces full color AMOLED displays, with screen sizes that can vary from 2 to 14 inch diagonal. The inline concept provides a stable and continuous production, without the requirement of manual substrate handling. With a fast tact time of 4 minutes, and a minimum of operators required to run the system, the PCAP-20 is the most cost effective production tool available.
General Specification
Substrate size: 355.6 x 355.6 mm (14 x 14)
Display type: Passive & Active matrix
Full Color (RGB - printing)
TFE (Thin Film Encapsulation)
Bottom Emission
Dimensions of the line: Length 33 m
Width 22 m
Height 4.5 m
PCAP20 specifications
General: - AM and PM PLED devices with interlayer, Ba-Al cathode, three-fold thin film encapsulation (TFE) and anti scratch layer
- 4 minute takt time for all systems
- 14x14 substrates, 0.7 mm borosilicate glass
Sheet cleaning and conditioning: - Sheetcleaner (Schmidt) with removal of protective coating (2 cascades TMAOH) and ultrasonically enhanced rinsing (2 cascades). Air knife drying.
- Drying oven
- Cool-down oven.
Pre-treatment and printing - Tepla 400 microwave plasma chamber (2 of) for Oxigen plasma cleaning
- Tepla 4011 microwave plasma chamber for Cfx deposition
- 5 Litrex 142 printers with Dimatix SX3 heads
- Drying, baking and cooldown ovens, nitrogen shrouded.
- Nitrogen shrouded handler.
Cathode and TFE deposition - Substrate alignment for cathode and TFE deposition
- Pre-treatment for cathode depostion (vacuum heat-up)
- Cathode deposition: Ba-Al. Layer thickness 100-1000 nm, quick mask exchange without vacuum breach.
- 4 nitride deposition deposition, substrate temperature 80 < 120 degC: dense nitride, no PLED degradation.
- 3 planarisation layer deposition by monomer printing (acrylic UV-curable monomer)
- Anti-scratch coating deposition by monomer printing (acrylic UV-curable monomer)
Test and unload - Fully automated testing: electrical, optical and display uniformity
- Unload for 20 substrates.
The PCAP20 is OTB Displays first fully integrated in line OLED Display production line. The line takes 14 square TFT glass substrates. These are cleaned, pre-treated, printed with OLED (RGB) light emitting materials, the cathode deposited and the displays encapsulated by a thin film multilayer to protect the OLED layers.
After passing through the PCAP20, the substrate is cut into separate modules that are further processed into display packages (including drive electronics).
The PCAP20 has been upgraded this year to achieve a tact time of 4 minutes.
The layout of the line enables easy access to every module. Service parts are easy to access in order to ensure maximum availability of the machine.
PCAP48
The PCAP48 is OTB´s in-line Gen 4 OLED display mass production equipment combining state-of-the-art deposition technology for depositing the functional layers with the high performance Thin Film Encapsulation technology developed by OTB. The development of the PCAP48 started in April 2009 and is aimed at completion Q4/2009-Q1/2010.
The PCAP48 is a full in-line machine. The Gen4 substrates enter the machine at the start of the line, and exit the line after deposition of the functional layers (the red, greed and blue OLED materials and the supporting layers, see link to OLED display explanation) and the deposition of the Thin Film encapsulation layers. After passing through the PCAP48, the substrate will be divided into separate modules that will be further processed into display packages (including drive electronics).
Many of the processes in the PCAP48 are done under vacuum conditions or in a non-ambient environment. OLED materials lifetimes are severely reduced after exposure to oxygen, water vapor and ozone. The TFE encapsulation shields the display’s materials from these vapors. Until these layers are deposited onto the display, it is shielded from these elements by the equipment.
The machine operates at a tact time of 2 minutes. It is equipped with advanced alignment systems, visual and other in-situ monitoring systems for quality control and auto-correction and an elaborate SCADA system.
The machine has a footprint of roughly 35 by 65 meters (depending on configuration).
PCAP48 Specifications:
Applications:
Bottom Emission type PMOLED, AMOLED on a-Si glass or LPTS Backplane
Full Color
mass production tool
Substrate Size (max.): 730x920mm glass
Substrate Thickness: 0.7 - 1.1mm
Display Product Range:
3.5"; 7"; 15" AM panels and larger panels
System Layout:
In-line fully automated manufacturing system
Tact time:
2 minutes at full production
Functional layer desposition:
Ink Jet printing of hole injection layers, interlayer and printable OLED emissive layers
Organic Vapor Jet Printing
Thin Film Encapsulation:
Inorganic layer: PECVD
Organic layer: printing
System Configuration:
Thin Film Encapsulation
TOTAL SOLUTION
OTB is able to provide any OEM with its “Total Solution” services, which includes the
The delivery of all these items puts the OEM in the immediate position of being able to manufacture and sell OLED displays with no bottlenecks or component supply delays- hence the term “Total Solution”.
OLED DISPLAYS
OTB has designed many displays including a 2.6 AMOLED, a 3.5 In QVGA AMOLED a 6 In WVGA AMOLED, 15 inch XVGA AMOLED, for both LTPS and amorphous silicon backplanes.
An example is the OTB 2.6 display module shown below:
PRODUCT ADVANTAGES
APPLICATION INFORMATION
PROCESSING MODULES
In addition to the PCAP In-Line Manufacturing System and Equipment, OTBv also sells individual modules such as its proprietary Thin Film Encapsulation tool.
The OTBv manufacturing process is set out below. If yu are interested in acquiring any of he following modules, contact OTBv;
Substrate handling system (the OTBv trolley or transport system)
OTB Manufacturing Process Diagram:
OPERATIONAL MANAGEMENT SERVICES
OTBv can provide the following additional types of consulting services to OEM and clients:
In other words OTBv is a full "service house" to its clients, not just OLED processing equipment
The engineers at OTBv are available to consult with any OEMs or other interested party about OLED core competencies, including OLED printing, OLED technology, in general, Thin Film Encapsulation and all other matters.
